FPA & IR, UV, X-Ray Sensoren

Bildsensoranwendungen in mehreren Spektral-Bereichen wie Infrarot-, UV- oder Röntgenstrahlen, umfassen eines der am schnellsten wachsenden Segmente der Halbleiter-Industrie, vor allem auf Grund der unglaublichen Fortschritte, die mit der Flip-Chip-Technologie möglich sind.

Während Kompressions-Bonden schnell die Standardtechnik für IR/FPA-Anwendungen (erfolgreich mit SET Bondern erreicht) geworden ist, freut sich SET, der Wegbereiter beim Einsatz von fortschrittlichen Reflow-Methoden zu sein, die viele bedeutende Vorteile bieten.

Die Reflow-Methode von SET bietet sorgfältig gesteuerte Temperaturwechselbeanspruchung, Joint ShapingFähigkeiten um die Belastung auf den Kontakten zu verringern und zuverlässiges hochgenaues Bonden zu gewährleisten.

Für diejenigen, die Bonden mit hohen Kräften wünschen, beispielsweise bei Raumtemperatur, suchen die stabilen Sockel aus Granit und extremen Bondkräfte der Bonder von SET ihres gleichen in der Industrie. Mittlerweile machen Sets- Weiterentwicklungen bei den hochauflösenden Bildgebungs- und Lasernivellierungs-Fähigkeiten hochgenaue Verbindungen noch erreichbarer, kontrollierbarer und garantieren höchste Parallelität.

Technisches Merkblatt

The SET Technical Bulletin n°3 is a compilation of technical articles written by some of our customers. Neatly organized and presented, each article provides unique insights of die-to-die and die-to-wafer bonding.

 

 




A few titles:



 Study of 15μm Pitch Solder Microbumps for 3D-IC Integration; 
 
 A Fluxless Bonding Process using AuSn or Indium for a Miniaturized Hermetic Package;
 
 High Density Cu-Sn TLP Bonding for 3D Integration;


 Three Dimensional Interconnects with High Aspect Ratio TSVs and Fine Pitch Solder Microbumps;


 An innovative die to wafer 3D integration scheme : Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling;

 

 

 Download the
SET Technical Bulletin N°3!

 

Konferenzberichte

Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme

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This paper will review three major areas of process or equipment development surrounding the above problems, namely the issue of throughput enhancement by using a sacrificial adhesive to temporarily tack the dice before collective bonding, the issue of prior or in-situ removal and prevention of surface oxides at the bonding interface, and the issue of local environmental control to reduce particulates and other airborne contaminants. Each of these 3 will be explored with hardware solutions proposed, along with process results on test vehicles or functional devices.

Keith Cooper from SET North America at IWLPC 2011

Chip-to-Wafer Technologies for High Density 3D Integration

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CEA-Leti partnering with SET, STMicroelectronics, ALES and CNRS-CEMES on advanced Chip-to-Wafer technologies for 3D Integration in the frame of the PROCEED project, a 4.2 Million Euros, 24 months project supported by French FIU (Fond Interministeriel Unique). Started in 2009, the goal of the PROCEED project is to demonstrate high alignment accuracy (<1µm) of chip-to-wafer structures made by direct metallic bonding.

Penned by CEA Leti, Minatec campus, CNRS Cemes, ALES, SET, ST Microelectronics and presented at MinaPad 2011

3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction

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3-Dimensional interconnection of high density integrated circuits enables building devices with greater functionality with higher performances in a smaller space. This paper explores the chip-to-chip and chip-to-wafer alignment and the associated bonding techniques such as in-situ reflow or thermocompression with a local oxide reduction which contributes to higher yield together with reduction of the force or temperature requirements.

Gilbert Lecarpentier from SET at Imaps Device Packaging 2011

Flip-chip die bonding: an enabling technology for 3D integration

Konferenzberichte

3-Dimensional Integration of Integrated Circuits is a method to build greater functionality into ever-smaller spaces for electronic circuitry, wherein dice of varying sizes, materials, or even application types are electrically and mechanically bonded together.

Keith Cooper from SET North America at IWLPC 2010

Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding

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25 um thick dies, mounted on thick carrier die, were placed on a 300mm landing wafer using the High Accuracy Die Bonder SET-FC300. The bonding process was either Cu/Cu or Cu/Sn with respective pitch of 108 µm and 408 µm...

Gilbert Lecarpentier from SET at Imaps Device Packaging 2010