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Quantum Computing
30. November 2017 Schwerpunkt auf Bonden Laden Sie
Qubit compatible superconducting interconnects
Toward a Flip-Chip Bonder dedicated to Direct Bonding for Production Environment
IWLPC 2017 Schwerpunkt auf Bonden SET, Saint-Jeoire, France Laden Sie
3D vertical integration of components is now an industrial reality. Considerations and results on direct bonding for HVM precise assembly are presented.
Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype
June 30, 2016 Schwerpunkt auf Bonden DPNC, University of Geneva, Switzerland Laden Sie
Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch
ECTC 2015 Schwerpunkt auf Bonden IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Laden Sie
Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors
7-12 September, 2014 Schwerpunkt auf Bonden UNIVERSITY OF SURREY, Guilford, Surrey, U.K. 10th International Conference on Position Sensitive Detectors Laden Sie
Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application
June 2014 Schwerpunkt auf Bonden IME - Journal of Electronics materials (abstract) Laden Sie
Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications
June 2014 Schwerpunkt auf Bonden RTI International Laden Sie
High Density Interconnect Bonding of Heterogeneous Materials Using Non-Collapsible Microbumps at 10 μm Pitch
June 2014 Schwerpunkt auf Bonden RTI International Laden Sie
Chip to wafer copper direct bonding electrical characterization and thermal cycling
December 2013 Schwerpunkt auf Bonden CEA – LETI, MINATEC Campus Laden Sie
Micro-tube insertion into aluminum pads: Simulation and experimental validations
IMAPS 2013 Schwerpunkt auf Bonden CEA – LETI, MINATEC Campus Laden Sie
9th International Conference and Exhibition on Device Packaging
This material is posted here with permission of IMAPS.
Aluminum to aluminum Bonding at Room Temperature
ECTC 2013 Schwerpunkt auf Bonden CEA – LETI, MINATEC Campus Laden Sie
Chip to wafer direct bonding technologies for high density 3D integration
ECTC 2012 Schwerpunkt auf Bonden CEA – LETI, MINATEC, STMicroelectronics, SET Laden Sie
A 10 μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications
ECTC 2011 Schwerpunkt auf Bonden CEA – LETI, MINATEC, LEM3 –CNRS/UPV-M Laden Sie
This material is posted here with permission of IEEE.
Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond
EPTC 2014 Schwerpunkt auf Bonden IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Singapore Laden Sie
Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly
ECTC 2011 Schwerpunkt auf Bonden IBM T.J. Watson Research Center Laden Sie
This material is posted here with permission of IEEE.
Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration
ECTC 2010 Schwerpunkt auf Bonden IMEC and the Katholieke Universiteit Leuven Laden Sie
This material is posted here with permission of IEEE.
Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process
ECTC 2010 Schwerpunkt auf Bonden Institute of Microelectronics - A*STAR Laden Sie
This material is posted here with permission of IEEE.
Ultrathin 3D ACA FlipChip-In-Flex Technology
ECTC 2010 Schwerpunkt auf Bonden Berlin Technical University, NB Technologies and Fraunhofer IZM Laden Sie
This material is posted here with permission of IEEE.
Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors
SPIE Defense, Sensing & Security 2010 Schwerpunkt auf Bonden HRL Laboratories Laden Sie
Copyright 2010 SPIE
SET Technical Bulletin N°3
February 2010 Schwerpunkt auf Bonden CEA-Leti, IMEC, ITRI, IME-A*Star, RTI, etc... Laden Sie
Embedded active device packaging technology for real DDR2 memory chips
IWLPC 2010 Schwerpunkt auf Bonden Industrial Technology Research Institute (ITRI) Laden Sie
Originally published in the IWLPC Proceedings
Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration
IMAPS 2010 Schwerpunkt auf Bonden RTI International Laden Sie
This material is posted here with permission of Imaps.
Development done on Device Bonder to address 3D requirements in a Production Environment
Schwerpunkt auf Bonden Laden Sie
IWLPC 2014 focus on bonding SET, Saint-Jeoire, France
Key to the success of 3D integration will be the ability to accurately align and bond devices with aggressive feature sizes
Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections
Device Packaging 2009 Schwerpunkt auf Bonden CEA-LETI Laden Sie
This material is posted here with permission of Imaps.
RF MEMS and flip-chip for space flight demonstrator
June 2009 Schwerpunkt auf Bonden Thales Alenia Space Laden Sie
New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array
ECTC 2008 Schwerpunkt auf Bonden CEA-LETI Laden Sie
This material is posted here with permission of IEEE.
NaPANIL „Library of Processes“
March 2012 Schwerpunkt auf Nano-Prägung NaPANIL Laden Sie
Second edition with results of the NaPANIL-project
UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale
November 2008 Schwerpunkt auf Nano-Prägung IISB Laden Sie
UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization
February 2008 Schwerpunkt auf Nano-Prägung CNR-IMM Laden Sie
Towards 5μm interconnection pitch with Die-to-Wafer direct hybrid bonding
ECTC 2021 Konferenzberichte
Die-to-wafer direct hybrid bonding process is foreseen as a key enabler of heterogeneous 3D integration. Hybrid bonding technologies were first developed on W2W assembly reaching 3D interconnection pitch of 1μm . Recently, CEA-Leti demonstrated the feasibility of DTW direct hybrid bonding at 10μm with a specific die bonder (NEO HB) developed by SET Corporation. In this paper, the last improvements of DTW hybrid bonding process flow and die bonder alignment capability are presented. Main results showed an alignment capability improved to <1μm which enables bonding of die with <5μm interconnection pitch. Finally, multi-interconnection pitch bondings on a wafer were achieved with Cu pitches varying from 5μm to 10μm.
https://ieeexplore.ieee.org/document/9501509/authors#authors
Die to Wafer Direct Hybrid Bonding Demonstration with High Alignment Accuracy and Electrical Yields
2019 International 3D Systems Integration Conference (3DIC) Konferenzberichte A. Jouve; L. Sanchez; C. Castan; N. Bresson; F. Fournel; N. Raynaud; P. Metzger Sendai, Japan
Opto-electronics flip-chip bonding automation and in-situ quality monitoring
Konferenzberichte Laden Sie
Aurélien Griffart from SET at EMPC – Pisa, Italy, September 16-19, 2019
Die-to-Wafer Direct Bonding for Production Environment with a New Flip-Chip Bonder
Konferenzberichte Laden Sie
P. Metzger, N. Raynaud
MiNaPAD 2019
New Flip-Chip Bonder dedicated to Direct Bonding for Production Environment
Konferenzberichte Laden Sie
Flip-chip bonding: how to meet the high accuracy requirements ?
Konferenzberichte Laden Sie
Caroline Avrillier from SET at EMPC – Warsaw, Poland, September 10-13, 2017
Flip-chip assembly for focal plane array
Konferenzberichte Laden Sie
Pascal Metzger from SET at IST :GST – Mumbai, India, November 25-26, 2017
Toward a flip-chip bonder dedicated to direct bonding for production environment
Konferenzberichte Laden Sie
Pascal Metzger from SET at IWLPC – San Jose, CA, USA, October 24-25, 2017
Considerations on the design of high precision Flip-Chip Bonder for mass production
European 3D Summit 2016 Konferenzberichte N. Raynaud Laden Sie
3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction
Konferenzberichte Laden Sie
Gilbert Lecarpentier from SET at Imaps Device Packaging 2011
Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding
Konferenzberichte Laden Sie
Gilbert Lecarpentier from SET at Imaps Device Packaging 2010
Flip-chip die bonding: an enabling technology for 3D integration
Konferenzberichte
Keith Cooper from SET North America at IWLPC 2010
Development done on Device Bonder to Address 3D Requirements in a Production Environment
Konferenzberichte Laden Sie
Pascal Metzger from SET at IWLPC, San Jose, November 11-13, 2014
Flip-Chip Assembly FPA
Konferenzberichte Laden Sie
Jean-Stéphane Mottet from SET at ORION – Moscow XXII International Conference Photoelectronics and Night Vision Devices, May 28th, 2014
Die-to-Die and Die-to-Wafer Bonding solution for High Density, Fine Pitch Micro-Bumped Die
Konferenzberichte Laden Sie
Gilbert Lecarpentier from SET at Imaps Device Packaging 2012
Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme
Konferenzberichte Laden Sie
Keith Cooper from SET North America at IWLPC 2011