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FC300R. The Union of Precision & Automation for 3D Integration.

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Press Releases

[11/2011]

Chip­-to­-Wafer Direct ­Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder

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SET - Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

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Your application requires a Die Bonder or a Flip Chip Bonder able to align and bond various type of components down to 0.5 µm post-bond accuracy...

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