SET. The World’s Leading Supplier of High Accuracy Bonders.

Learn more

FC300R. The Union of Precision & Automation for 3D Integration.

Watch the FC300R video!

To keep up-to-date with recent developments on Device Bonding :

Sign-up & read SET Insights

Press Releases

[11/2011]

Chip­-to­-Wafer Direct ­Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder

More Headlines

SET e-Newsletter

Sign up

Events

MiNaPAD, May 20-22, 2014 - Grenoble, France

Show calendar

Explore the World of Absolute Bonding Precision.

SET - Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

Device Bonder line

Your application requires a Die Bonder or a Flip Chip Bonder able to align and bond various type of components down to 0.5 µm post-bond accuracy...

Discover SET's  bonders :
FC300R, FC300, FC150, KADETT, LDP150

Spotlights