SET’s team is pleased to launch two new equipment, ACCµRA OPTO and ACCµRA M.
ACCµRA OPTO is perfectly adapted to optoelectronics applications, such as precise assembly of VECSEL, laser, diodes, lenses, prisms, requiring low bonding force.
ACCµRA M is the perfect tool for flip-chip bonding applications for education and R&D. All axes are manual, except the vertical one allowing high repeatability and precise control in the assembly process.
These two equipment will be on our booth #713, Hall C at MICRONORA Besançon 27-30 September 2016. Please feel free to come and discuss with our team.
Device Bonder line
ACCμRATM100
Discover our brand new machine !
This table top machine guarantees ± 0.5 μm post-bonding accuracy. Very flexible, it is the perfect equipment for universities and R&D institutes.
Watch the video
Discover SET's bonders :
ACCµRA M, ACCµRA OPTO, FC300, FC150, KADETT, LDP150