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 Do you need to buy a Die Bonder or a Flip Chip Bonder able to align and bond small and fragile components down to 0.5 µm post-bond accuracy?
The SET chip-to-chip and chip-to-wafer bonders adapt to all main bonding techniques: fluxless reflow, adhesive joining and compression.
With an installed base of more than 300 Device Bonders worldwide, SET is globally renowned for the unsurpassed post-bonding accuracy and the flexibility of its systems.
 More about SET
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Die Bonders/
Flip Chip Bonders |
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Bonding Applications |
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Discover SET's bonders for Die Bonding, Pick & Place and Flip Chip Bonding: FC150, FC300, FC300R, Kadett...
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Our equipment support a wide range of bonding applications:
IR-FPA, optoelectronics, 3D integration, MEMS, RF...
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| Nano imPrinting Stepper |
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NIL Applications |
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| Discover more about the NPS300, the SET's Nano imPrinting Stepper for replication of nano structures... |
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Our systems feature various imprinting techniques:
UV-NIL and
Hot Embossing Lithography...
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