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SET
Smart Equipment Technology SAS
74490 Saint Jeoire - France
Tel. :
+33 (0)450 35 83 92
Fax :
+33 (0)450 35 88 01
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Are you looking for a Die Bonder or a Flip Chip Bonder able to align and bond small and fragile components at less than 1 µm post bond accuracy?
The SET chip-to-chip and chip-to-wafer bonders adapt to all main bonding techniques: fluxless reflow, adhesive joining and compression.
As a supplier of semiconductor equipment dedicated to high precision applications for over 30 years SET has developed over 30 different types of equipment. First introduced in 1981, the Device Bonder line became the primary focus of the company in 1997. With an installed base of more than 300 Device Bonders worldwide, SET is globally renowned for the unsurpassed post bonding accuracy and the flexibility of its systems.
 Read more about SET |
Die Bonders/
Flip Chip Bonders |
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Bonding Applications |
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Discover SET's bonders for Die Bonding, Pick & Place and Flip Chip Bonding: FC150, FC300, LDP150, Kadett...
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The SET's systems support a wide range of bonding applications:
IR-FPA, optoelectronics, 3D-stacking, MEMS, RF, LCD...
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| Nano imPrinting Stepper |
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NIL Applications |
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| Discover more about the NPS300, the SET's Nano imPrinting Stepper for replication of nano structures... |
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SET's systems feature various imprinting techniques such as UV-NIL and Hot Embossing Lithography...
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