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FC300R. The Union of Precision & Automation for 3D Integration.

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Press Releases

[11/2011]

Chip­-to­-Wafer Direct ­Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder

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SET - Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

Device Bonder line

ACCμRATM100
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This table top machine guarantees ± 0.5 μm post-bonding accuracy. Very flexible, it is the perfect equipment for universities and R&D institutes.
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