The ACCμRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy. It is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of your process.
The ACCμRA OPTO combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.

Key Benefits

  • Small footprint
  • Easy to use
  • Quick Set-Up
  • R&D oriented
  • Low Force

Technical Data

Click here to request the ACCµRA OPTO Datasheet.

Process Capabilities

  • Thermocompression
  • Reflow
  • UV Curing
  • Au, Au/Sn, In, Cu, Cu/Sn