ACCµRA OPTO

The ACCμRA OPTO is a Flip-Chip Bonder that permits to reach ± 0.5 μm post-bond accuracy.

It is dedicated to low force and reflow processes.
Motorized axes guarantee a high repeatability of your process.

The ACCμRA OPTO combines high precision, flexibility and accessibility.
It is the perfect equipment for optoelectronics and silicon photonics applications.

 

ACCµRA OPTO

Key benefits

  • ± 0.5 μm post-bond accuracy
  • Small footprint
  • Easy to use
  • Quick Set-Up
  • R&D oriented
  • Low Force

Process capabilities

  • Thermocompression
  • Reflow
  • UV Curing
  • Au, Au/Sn, In, Cu, Cu/Sn

Applications

Technical data

Click here to request the ACCµRA OPTO datasheet.