The ACCμRA M is a manual flip-chip bonder that allows ± 3 μm accuracy. This equipment permits to align manually the components with a high level of precision.
The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.
The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.
It is the perfect equipment for universities and R&D institutes.
- Small footprint
- Manual machine
- Easy to use
- Open platform
- R&D oriented
Click here to request the ACCµRA M Datasheet.
- UV Curing
- Au, Au/Sn, In, Cu