The ACCμRA M is a manual flip-chip bonder that permits to align manually the components with a high level of precision.
It allows ± 3 μm accuracy.
The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.
The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.
It is the perfect equipment for universities and R&D institutes.
Easy to use
Click here to request the ACCµRA M Datasheet.
Au, Au/Sn, In, Cu