Explore the World of Absolute Bonding Precision
SET, Smart Equipment Technology, is a world leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders. Founded in 1975, SET has pioneered in the development of flip chip bonders for infrared sensors and optoelectronics applications.
With an installed base of more than 300 Device Bonders worldwide, SET is globally renowned for the unsurpassed sub-micron post-bonding accuracy and the flexibility of its systems.
Thanks to several decades of high accuracy placement expertise, SET brings also to the market cutting-edge nanoimprint solutions which offer proven sub-micron alignment capabilities also combined with superior flexibility.