Chip-to-Wafer Direct Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder
SEMICON Taiwan 2015, September 2-4, 2015 - TWTC Nangang Exhibition Hall, Taipei, Taiwan
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This table top machine guarantees ± 0.5 μm post-bonding accuracy. Very flexible, it is the perfect equipment for universities and R&D institutes.Watch the video
Discover SET's bonders : FC300R, FC300, FC150, KADETT, LDP150