SET. The World’s Leading Supplier of High Accuracy Bonders.

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FC300R. The Union of Precision & Automation for 3D Integration.

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Explore the World of Absolute Bonding Precision.

SET - Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

Device Bonder line

ACCμRATM100
Discover our brand new machine !
This table top machine guarantees ± 0.5 μm post-bonding accuracy. Very flexible, it is the perfect equipment for universities and R&D institutes.
Watch the video Discover SET's  bonders :
FC300R, FC300, FC150, KADETT, LDP150