SET’s team is pleased to launch two new equipment, ACCµRA OPTO and ACCµRA M.
ACCµRA OPTO is perfectly adapted to optoelectronics applications, such as precise assembly of VECSEL, laser, diodes, lenses, prisms, requiring low bonding force.
ACCµRA M is the perfect tool for flip-chip bonding applications for education and R&D. All axes are manual, except the vertical one allowing high repeatability and precise control in the assembly process.
These two equipment will be on our booth #514, Hall 7 at SMT Hybrid Packaging in Nuremberg. Please feel free to come and discuss with our team.