Chip-to-Wafer Direct Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder
European 3D TSV Summit, January 20-21, 2015, Grenoble, France
Discover our brand new machine !
This table top machine guarantees ± 0.5 μm post-bonding accuracy. Very flexible, it is the perfect equipment for universities and R&D institutes.Watch the video
Discover SET's bonders : FC300R, FC300, FC150, KADETT, LDP150