FC300: The High Precision Die Bonder for Large Devices
The FC300 High Precision Die / Flip Chip Bonder is a newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm.
The tool features automated handling of chips and substrates up to 100 mm from waffle packs, plus a robotic option enabling chip picking from diced wafer and automated handling of larger substrate. It features also Nanoimprinting Lithography (NIL) capabilities.
With a quick process head reconfiguration, the FC300 platform performs multiple applications including:
High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging, or Nanoimprinting using a Hot Embossing Lithography process; Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly; UV-Curing for a Adhesive Bonding or for Nanoimprinting using a UV-NIL process.
± 0.5 µm post bond accuracy and 20 µradians leveling guarantee highest quality for the most advanced products Semi-Open Confinement Chamber for Oxide Reduction (option) Bonding of devices up to 100 x 100 mm onto wafer up to 300 mm to enable large format assemblies NIL configuration as add-on to bonding capability for maximum flexibility Air bearing construction on a granite structure ensures long-term stability and reliability Optional integrated chamber for gang reflow in a gas or vacuum environment
High End Processes
Die Bonding (Face Up), Flip Chip Bonding (Face to Face), Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding, Thermocompression Bonding, Ultrasonic Bonding, UV-Curing Bonding, Adhesive Bonding, UV-NIL, Hot Embossing Lithography...
High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging, or Nanoimprinting using a Hot Embossing Lithography process;
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Features and Benefits
