SET LAUNCHES THE NEO HB - New Product in the World of Flip-Chip Bonding
10/2019 - During the SEMICON trade show in Taiwan (September 2019) SET officially launched the NEO HB. The NEO HB is SET’s newest production Flip-Chip Bonder and was developed in partnership with the Nanoelec Technological Research Institute in Grenoble.
Automated and Ultra-Precise
With a post-bonding accuracy of +/- 1 μm (3 sigmas) in stand-alone or fully automatic mode, SET's latest flip-chip bonder is designed for production. Combining high precision, flexibility and short cycle time, the NEO HB is perfectly suited to hybrid or direct bonding (HB) processes.
The First in a New Line
The NEO HB, with its sleek design and its easy-to-use interface is the first of a new line of flip-chip bonders dedicated entirely to production. Three configurations are available: Chip-to-Chip, Chip-to-Wafer or Hybrid Bonding. Entirely driven by software and robotics, the NEO line offers a high production rate with an accuracy of +/- 1 μm, making production volumes highly profitable with a great return on investment. The NEO follows SET’s other lines, ACCµRA and FC.