SET SUCCESS STORY
11/20 - The ACCµRA100 Flip-Chip Bonder at the Technische Universität Ilmenau, Germany
What can you tell us about your University Department? What are you specialized in?
Our research group is known worldwide for its work on the use of robust Low Temperature Cofired Ceramics (LTCC) technology for applications in high frequency technology (e.g. satellite communication) and sensor technology. The focus of research is on the functional integration and miniaturization of such systems, taking into account high reliability requirements.
Why did Technische Universität Ilmenau buy an ACCµRA100?
The upcoming research projects in the field of microwave technology and photonics integration require high-precision flip chip assembly, which goes far beyond the capabilities of an existing system at our Center for Micro- and Nanotechnologies. In addition, there was the desire to join with ultrasonic support in addition to pure thermocompression bonding.
Through a demonstration at the University of Geneva, who had already purchased an ACCµRA100, we were finally able to convince ourselves of the performance and the intuitive operating concept.
What kind of applications are you developing with your ACCµRA100?
The bonder is used for several research projects and student teaching. In addition to precise bonding on pure LTCC substrates, circuits based on the silicon-LTCC composite technology developed at the TU Ilmenau are becoming much more important. This means that in addition to the classical thick film metallization, thin film structures are also included, which require a higher overall assembly accuracy. In addition, current research work is underway on the use of glass substrates as interposers. One planned project is targeting at the assembly of quantum-optical devices on these substrates.
- FLIP-CHIP BONDER LINE