SET Insight N°13 is available!
The end of the year is coming as usually very quickly. 2013 as been very busy with conferences and exhibition as SEMICON shows all around the world and also with very interesting papers in 3D TSV Summit, ECTC, IMAPS and IWLPC.
The coming year will also be full of events. SET CORPORATION will be present on main different events as:
- 2nd edition of the 3D TSV Summit in Grenoble on January 20-21-22nd, 2014. You are very welcome on our booth.
- SEMICON Korea in Seoul on February 12-13-14th, 2014. SET will be present on the booth #2373 of our agent in Korea Woowon Technology.
- SEMICON China in Shanghai on March 18-19-20th, 2014. SET will be present on the booth #2109 of our agent in China, SÜSS MicroTec.
- and more events will come and will be advertised on our Website.
2014 is going to be also an important year, where one new equipment is going to be introduced on the market. This High Accuracy Bonder will complete the SET portfolio with a table top model. It will be a simple and flexible machine with a very friendly user interface. This equipment will allow different users and in particular universities or research centers to benefit from new high-end processes and applications at reasonable costs.
SET CORPORATION received "Democracy" trophy on November 30th, 2013, during the 6th edition of the Solidary Employment Forum in Rhône-Alpes, in Hôtel de Région in Lyon.
Pascal Metzger, CEO, and the entire team thank a lot the jury and Mr. Cyril Kretzschmar, regional councilor, vice-president of social and solidarity economy (ESS).