To learn more about SET's Cutting-Edge Bonding Solutions, visit SET Booth N°21 and meet our experts:

 to discuss about recent developments in 3D integration and 
    Optoelectronics packaging;

 to discover the SET FC300, the assembly tool for 3D-IC's
   onto wafer up to 300 mm.

 If you would like to make advance arrangements with our experts at ESTC,
feel free to contact us on info@set-sas.fr.

 Register NOW on ESTC website!

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