IWLPC, October 11-14, Santa Clara, USA
SET will be attending IWLPC from the 11th to the 14th of October, at the Santa Clara Marriott Hotel.


 To learn about SET's Cutting-Edge Bonding Solutions:


1) visit SET's Booth from the 13rd to the 14th of October and meet our experts:

 to discuss about recent developments in 3D-IC with high density TSVs,
 to learn more about the FC300.

 To make advance arrangements with our experts at IWLPC, contact us on info@set-sas.fr.


2) come & hear SET's presentation made by Keith Cooper from SET North America:

 Subject: Flip Chip Die Bonding, an Enabling Technology for 3D-IC Integration
 Abstract:
 Date: Wednesday, October 13 at 2:30 pm

 REGISTER now on IWLPC's website! Early bird registration until September 10!
    (Prices go up $100 after then for conference and tutorials.)


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