SET Smart Equipment Technology SAS 74490 Saint Jeoire - France Tel. : +33 (0)450 35 83 92 Fax : +33 (0)450 35 88 01
Download the SET Technical Bulletin N°3
The SET Technical Bulletin is a compilation of flip chip and die bonding technical articles written by our clients. Neatly organized and presented, each article provides unique insights into the exciting area of die-to-die and die-to-wafer bonding.
A few titles:
Study of 15μm Pitch Solder Microbumps for 3D-IC Integration;
A Fluxless Bonding Process using AuSn or Indium for a Miniaturized Hermetic Package;
High Density Cu-Sn TLP Bonding for 3D Integration;
Three Dimensional Interconnects with High Aspect Ratio TSVs and Fine Pitch Solder Microbumps;
An innovative die to wafer 3D integration scheme : Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling;
3D Stacked Chip Technology Using Bottom-up Electroplated TSVs;
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Study of 15μm Pitch Solder Microbumps for 3D-IC Integration; 
