During the 60^th Electronic Components and Technology Conference (ECTC*) in Las Vegas, Replisaurus paper titled "Novel Multi-Layer Wiring Buildup using ElectroChemical Pattern Replication (ECPR)" was announced as the Best of Conference Paper from ECTC 2009. The authors, Mikael Fredenberg and Patrik Möller from Replisaurus and Michael Töpper from Fraunhofer IZM received the award for the paper describing a novel manufacturing sequence for top metal layers on IC chips enabled by ECPR metallization and planarized dielectric layers.

The development of the ECPR technology started at the Lund Institute of Technology in 2001, based on new ideas for nanoscale electrodeposition of metal patterns. In 2002 the first proof-of-concept was achieved and the development of processes and equipment was continued. The company Replisaurus Technologies was founded by Mikael Fredenberg and Patrik Möller and in the beginning of 2003 Replisaurus moved to Kista, Stockholm. Through strategic alliances with equipment suppliers, institutes like the Fraunhofer IZM (Berlin) since 2006 and semiconductor manufacturers the development and evaluation of industrial automated production solutions are ongoing. Using ECPR, the accuracy of metallization for microelectronic applications can be increased at the same time as the cost can be significantly reduced compared to using traditional lithography based processes. Replisaurus offers complete production solutions including master electrodes, fully integrated ECPR tools, chemicals and processing guidelines. The cooperation with Fraunhofer IZM guarantees the link to the newest trends in electronic packaging. This fruitful cooperation was honoured this year by the ECTC “Best Paper of Conference” award.

Dr. Michael Töpper holds a PhD in material science from the Technical University of Berlin and heads a Fraunhofer IZM research group specializing in wafer-level processes. Since 2006 he has also served as a Research Associate Professor at the University of Utah. He has authored and co-authored more than 130 papers on electronic packaging, is a co-founder of the SECAP International Consortium for Advanced Packaging, and is currently chairing the IEEE Technical Committee of Wafer Level Packaging.

Patrik Möller, VP Technology Integration is co-founder and inventor of the ECPR-technology. Prior to starting Replisaurus Patrik was engaged in two other Swedish technology startups, one working in the field of Nano Imprinting and printed circuit board manufacturing technology. Patrik has a Master of Science degree in Chemical Engineering from LTH, Lund with specialization in micro and nanotechnology at UC Berkeley, California and studies in Business administration and Economics from Lund University.

Mikael Fredenberg, VP Process Integration is co-founder and co-inventor of the ECPR technology. Mikael has a Master of Science degree in Chemical Engineering from LTH, and a Bachelor degree in Business administration from Lund University. Prior to starting Replisaurus Mikael has professional experience in technical development, dynamic modeling as well as market research from previous engagements in tech companies

About Replisaurus Technologies
Replisaurus has developed ElectroChemical Pattern Replication (ECPR™), a revolutionary metallization technology targeted at key growth markets in semiconductor manufacturing. ECPR offers a simple and cost effective integrated solution eliminating several traditional process steps thereby reducing complexity. ECPR is a fab-friendly, environmentally clean process which does not use solvents, developers or strippers, enables advanced designs while reducing cost. Replisaurus acquired SET in 2008. For more information please visit us at www.replisaurus.com.

About Fraunhofer IZM
Internet-enabled PDAs, mobile medical diagnosis devices or fuel-efficient vehicles - nowadays everything requires highly integrated microelectronics and microsystem technology to function. The trend is towards increasingly small, higher performance and more economical high-tech products. The foundation of this ongoing product development is the availability of miniaturized components and reliable and cost-effective assembly technology. Fraunhofer IZM's R&D is rooted in the methods, processes and technologies from the areas of system integration and electronic packaging on wafer-, chip- and board-level. Our core topics reflect the entire spectrum of integration processes in microelectronics and microsystem technology. Transferring our research outcomes to industrial manufacturing processes, e.g. in the automotive, mechanical engineering or IT industries is one of our main targets. For more information, visit www.izm.fraunhofer.de.