SET in Chip Scale Review magazine
Direct metallic bonding for 3D-IC

Title: Direct Copper Bonding of High-Density 3D Assemblies

By By Gilbert Lecarpentier [SET], Marc Legros and Mayerling Martinez [CEMES-CNRS], Alexis Farcy and Brigitte Descouts [STMicroelectronics], Emmanuel Augendre and Thomas Signamarcheix [CEA-LETI], and Vincent Lelièvre and Aziz Ouerd [ALES].


 To read this article featuring the contribution of each partner of the PROCEED project and the advantages of the C2W direct bonding process for high density integration:

 click on the edition cover

to download
the pdf file of the magazine!


  (7,49 Mb)

Chip to Wafer Bonding, Direct Bonding, Die to Wafer Bonding, 3D integration








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