QSPI 2018 Conference, Stockholm - Sweden, June 16-21, 2018
SET will be attending QSPI 2018 Conference, Stockholm, Sweden, June 16-21 2018
To learn more about Flip-Chip Technology for Image Sensors come and listen our expert.
SEMICON West, July 10-12, 2018, Moscone Center, San Francisco - CA, USA
Visit SET on our booth #6358 and meet our experts from SET and SET North America at SEMICON WEST 2018
CIOE Shenzhen, China 2018, September 5-8, 2018
Visit SET on our booth and meet our experts from SET and SÜSS MicroTec China and SET at CIOE 2018
ESTC 2018, Westin Bellevue, Dresden, Germany - September 18-21, 2018
SET will be attending ESTC 2018 in DRESDEN, Germany, September 18-21, 2018
Pascal METZGER, CEO, will present a paper about "NEW FLIP-CHIP BONDER DEDICATED TO DIRECT BONDING FOR PRODUCTION ENVIRONMENT".
Come, listen and meet our CEO to discuss about your needs and our expertise.
IWLPC 2018, October 23-25, 2018, DoubleTree by Hilton, San Jose - CA, USA
Visit SET on our booth, attend to our presentation and meet our experts from SET-NA and SET a IWLPC 2018