SET NEXT SHOWS

 

MiNaPAD | February 2-3, 2021 | WTC, Grenoble, France

 

Pascal METZGER, CEO of SET, will present a paper entitled "Die-to Wafer Hybrid bonding equipment: throughput versus precision".

Come listen to him at MiNaPAD and meet him to discuss about your needs and our expertise.

 


SEMICON Korea | February 3-5, 2021 | COEX, Seoul, Korea

 

SET will be attending SEMICON Korea at the Convention & Exhibition Center (COEX) of Seoul.

Visit us at Woowon Technology's Booth.

If you would like to arrange a meeting during SEMICON Korea, feel free to contact us.

 


SPIE Photonics West | March 6-11, 2021 | San Francisco, California, USA

 

Meet our Flip-Chip Bonders Experts on SET BOOTH # 4642.

Feel free to contact us to arrange a meeting.

 


SEMICON China | March 17-19, 2021 | SNIEC, Shanghai, China

 

SET will be attending SEMICON China at Shanghai New International Expo Centre.

Visit SET Booth and meet our experts.

To make advance arrangements with our team, feel free to contact us.