News & Events

ECTC 2018, May 29 - June 1, 2018, Sheraton San Diego Hotel & Marina San Diego, CA

Visit SET at ECTC 2018, and discuss with our experts on your needs


SMT Hybrid Packaging, June 5-7, 2018, Exhibition Centre Nuremberg, Germany

Visit SET and meet our experts from HILPERT Electronics and SET, Hall 5 - Booth 105 at SMT Hybrid Packaging 2018


SEMICON West, July 10-12, 2018, Moscone Center, San Francisco CA, USA

Visit SET on our booth #6358 and meet our experts from SET and SET North America at Semicon West 2018:

  • To learn more about the brand new Flip-Chip Bonder ACCµRA family, especially designed for R&D and pilot lines
  • To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications

CIOE Shenzhen, China 2018, September 5-8, 2018

Visit SET on our booth and meet our experts from SÜSS MicroTec China and SET at CIOE 2018


IWLPC 2018, October 23-25, 2018, DoubleTree by Hilton, San Jose, CA, USA

Visit SET on our booth, attend to our presentation and meet our experts from SET-NA and SET a IWLPC 2018:
•    To learn more about the brand new Flip-Chip Bonder ACCµRA family, especially designed for R&D and pilot lines.
•    To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications.