IWLPC 2017, October 24-26, 2017, Double Tree Hotel, San Jose, CA, USA
Visit SET on our booth #68, attend to our presentation and meet our experts from SET-NA and SET at IWLPC 2017:
• To learn more about the brand new Flip-Chip Bonder ACCµRA family, especially designed for R&D and pilot lines.
• To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications.
SEMICON Europa, November 14-17, 2017, Messe München, Munich, Germany
Visit SET on booth #B1-1831 and meet our experts at SEMICON Europa 2017 :