MiNaPAD | February 2-3, 2021 | WTC, Grenoble, France
Pascal METZGER, CEO of SET, will present a paper entitled "Die-to Wafer Hybrid bonding equipment: throughput versus precision".
Come listen to him at MiNaPAD and meet him to discuss about your needs and our expertise.
SPIE Photonics West | March 6-11, 2021 | San Francisco, California, USA
Meet our Flip-Chip Bonders Experts on SET BOOTH # 4642.
Feel free to contact us to arrange a meeting.