News & Events

IWLPC 2018, October 23-25, 2018, Double Tree by Hilton, San Jose - CA, USA

Visit SET on booth #11, attend to our presentation and meet our experts from SET-NA and SET a IWLPC 2018

SEMICON Europa, 13-16 November 2018, Messe München, Munich, Germany

Visit SET on booth #A4-142 to discover our brand new full automatic Flip-Chip Bonder ACCµRA Plus and meet our experts at SEMICON Europa 2018


EMAP 2018 - December 17-20, 2018 - Hong Kong University of Science and Technology

Visit SET and meet our expert at EMAP 2018

NEPCON JAPAN - January 16-18, 2019 - Tokyo, Japan


If you would like to arrange a meeting during NEPCON JAPAN feel free to contact us

SEMICON Korea 2019, January 23-25, 2018 - COEX, Seoul, Korea

SET will be attending Semicon Korea at the Convention & Exhibition Center (COEX) of Seoul.

SEMICON China 2019, March 20-22, 2019, SNIEC, Shanghai, China

SET will be attending Semicon China at Shanghai New International Expo Centre.

Visit SET on Booth #2481 and meet our experts:

 To make advance arrangements with our experts at Semicon China 2019 feel free to contact us