News & Events

IMAPS, 14th International Conference and Exhibition on Device Packaging, March 5-8, 2018, Fountain Hills, Arizona, USA

SET North America will be attending IMAPS, 14th International Conference and Exhibition on Device Packaging, Fountain Hills, Arizona - USA


SEMICON China 2018, March 14-16, 2018, SNIEC, Shanghai, China

SET will be attending Semicon China at Shanghai New International Expo Centre.

Visit SET on Booth #1685 and meet our experts:

To learn more about the brand new Flip-Chip Bonder ACCµRA family, especially designed for R&D and pilot lines;

 To make advance arrangements with our experts at Semicon China 2018 feel free to contact us

 


MICROTECH 2018 - April 9-10, 2018, Egham, TW20 0EX, United Kingdom

SET will be attending MICROTECH 2018, a iMAPS event in Egham (UK).

Jean-Stéphane MOTTET will make a presentation about "Flip-Chip Bonding: How to meet high accuracy requirements?" on April 10th at 14:50. Listen to him and meet him to discuss about your needs.


ECTC 2018, May 29 - June 1, 2018, Sheraton San Diego Hotel & Marina San Diego, CA

Visit SET at ECTC 2018, and discuss with our experts on your needs


SMT Hybrid Packaging, June 5-7, 2018, Exhibition Centre Nuremberg, Germany

Visit SET and meet our experts from HILPERT Electronics and SET at SMT Hybrid Packaging 2018

 


SEMICON West, July 10-12, 2018, Moscone Center, San Francisco CA, USA

Visit SET on our booth #6358 and meet our experts from SET and SET North America at Semicon West 2018:

  • To learn more about the brand new Flip-Chip Bonder ACCµRA family, especially designed for R&D and pilot lines
  • To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications

IWLPC 2018, October 23-25, 2018, DoubleTree by Hilton, San Jose, CA, USA

Visit SET on our booth, attend to our presentation and meet our experts from SET-NA and SET a IWLPC 2018:
•    To learn more about the brand new Flip-Chip Bonder ACCµRA family, especially designed for R&D and pilot lines.
•    To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications.