News & Events

IWLPC 2017, October 24-26, 2017, Double Tree Hotel, San Jose, CA, USA

Visit SET on our booth #68, attend to our presentation and meet our experts from SET-NA and SET at IWLPC 2017:
•    To learn more about the brand new Flip-Chip Bonder ACCµRA family, especially designed for R&D and pilot lines.
•    To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications.
 


SEMICON Europa, November 14-17, 2017, Messe München, Munich, Germany

Visit SET on booth #B1-1831 and meet our experts at  SEMICON Europa 2017 :

  • To discover two new equipment exposed on the booth: ACCµRA™OPTO and ACCµRA M
  • To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications.