News & Events

SMT Hybrid Packaging, May 16-18, 2017, Exhibition Centre Nuremberg, Germany

 

Visit SET on booth #4-331 and meet our experts from HILPERT Electronics and SET at SMT Hybrid Packaging 2017

At the occasion, SET will expose on the booth two new equipment: ACCµRA™OPTO and ACCµRA M


ECTC, 2017, May 30-June 2, Lake Buena Vista, USA

Visit our booth, # 120, at ECTC 2017, and discuss with our experts on your needs


SEMICON West, July 11-13, 2017, Moscone Center, San Francisco CA, USA

Visit SET on our booth and meet our experts from SET-NA and SET at Semicon West 2017:

  • To learn more about the brand new Flip-Chip Bonder ACCµRA family, especially designed for R&D and pilot lines
  • To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications

CIOE Shenzhen, China 2017, September 6-9, 2017

Visit SET on our booth and meet our experts from SÜSS MicroTec China and SET at CIOE 2017:

  • To learn more about the brand new Flip-Chip Bonder ACCµRA family, especially designed for R&D and pilot lines
  • To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications

SEMICON Taiwan 2017, September 13-15, 2017 - TWTC Nangang Exhibition Hall, Taipei, Taiwan

Visit SET on booth #020 (4F) and meet our experts from DKSH and SET at Semicon Taiwan:

  • To learn more about the brand new ACCµRA 100 ™, ACCµRA OPTO and ACCµRA M Bonders, especially designed for R&D and pilot lines
  • To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications

SEMICON Europa, November 14-17, 2017, Messe München, Munich, Germany

Visit SET on booth #B1-1831 and meet our experts at  SEMICON Europa 2017 :

  • To discover two new equipment exposed on the booth : ACCµRA™OPTO and ACCµRA M
  • To discuss on the future equipment for High Volume Production, especially for 3D-Integration and Silicon Photonics applications