French National Bank for Investment, has labeled SET “BPI Excellence”
03/2017 – SET is again labeled BPI Excellence.
09/2016 - SET is proud to announce it received a “Micron d’Or” (Golden Micron) at Micronora Fair end of September 2016, in Besançon, France
06/2016 - SET was present at ECTC, a major conference on packaging, in Las Vegas from May 31st to June 3rd 2016.
SET is proud to announce a new and important partnership!
01/2016 - SET is proud to announce a new and important partnership, joining French consortium IRT Nanoelec based in Grenoble and headed by CEA-Leti.
For more details, please refer to the Press release.
06/2013 – SET joined Minalogic.
Chip-to-Wafer Direct Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder
02/2011 - CEA Leti Partnering with SET, STMicroelectronics, ALES and CNRS-CEMES on Advanced Chip-to-Wafer Technologies for 3D Integration.
SET Introduces FC300R High Accuracy Device Bonder with Robotics
07/2011 - FC300R: an Easy-to-Use Production Platform Ideal for High Accuracy C2W Bonding, Die Attach, Flip-Chip and 3D Integration with TSV.
SET introduces Innovative Patented Chamber for Removal of Oxide
10/2010 - SET's Latest Developments in Oxide Removal
SET receives strategic wafer level packaging equipment order from SEMATECH at UAlbany NanoCollege
09/2010 - SEMATECH Will Perform Innovative 3D Applications at CNSE’s Albany NanoTech with SET’s High Accuracy FC300 System.
SET to collaborate with IMEC on 3D integration research
01/2009 - A Joint Development Program Will Employ S.E.T.'s High Accuracy FC300 System to Explore Advanced 3D Applications.