INNOWARDS 2018: SET WINNER OF INNOMANAGEMENT PRIZE
At the 3rd annual InnoWards in Annecy, France, SET was awarded the InnoManagement Prize. This was in recognition of SET’s strong teamwork.
SET second most successful company of Haute-Savoie
12/2017 – SET is classified the second most successful company of Haute-Savoie by the French newspaper Le Dauphiné Libéré.
SET in the Forum of the FIT 2017
11/2017 – SET participates in the Forum of the FIT on 2017 in Paris.
French National Bank for Investment, has labeled SET “BPI Excellence”
03/2017 – SET is again labeled BPI Excellence.
09/2016 - SET is proud to announce it received a “Micron d’Or” (Golden Micron) at Micronora Fair end of September 2016, in Besançon, France
06/2016 - SET was present at ECTC, a major conference on packaging, in Las Vegas from May 31st to June 3rd 2016.
SET is proud to announce a new and important partnership!
01/2016 - SET is proud to announce a new and important partnership, joining French consortium IRT Nanoelec based in Grenoble and headed by CEA-Leti.
For more details, please refer to the Press release.
06/2013 – SET joined Minalogic.
Chip-to-Wafer Direct Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder
02/2011 - CEA Leti Partnering with SET, STMicroelectronics, ALES and CNRS-CEMES on Advanced Chip-to-Wafer Technologies for 3D Integration.
SET Introduces FC300R High Accuracy Device Bonder with Robotics
07/2011 - FC300R: an Easy-to-Use Production Platform Ideal for High Accuracy C2W Bonding, Die Attach, Flip-Chip and 3D Integration with TSV.