Press Releases

French National Bank for Investment, has labeled SET “BPI Excellence”

03/2017 – SET is again labeled BPI Excellence.


MICRON D'OR

09/2016 - SET is proud to announce it received a “Micron d’Or” (Golden Micron) at Micronora Fair end of September 2016, in Besançon, France


ECTC 2016

06/2016 - SET was present at ECTC, a major conference on packaging, in Las Vegas from May 31st to June 3rd 2016.


SET is proud to announce a new and important partnership!

01/2016 - SET is proud to announce a new and important partnership, joining French consortium IRT Nanoelec based in Grenoble and headed by CEA-Leti.
For more details, please refer to the Press release.


MINALOGIC

06/2013 – SET joined Minalogic.


Chip­-to­-Wafer Direct ­Metallic Bonding technology developed at Leti used in customized 300 mm Device Bonder

02/2011 - CEA ­Leti Partnering with SET, STMicroelectronics, ALES and CNRS­-CEMES on Advanced Chip-­to-­Wafer Technologies for 3D Integration.


SET Introduces FC300R High Accuracy Device Bonder with Robotics

07/2011 - FC300R: an Easy-to-Use Production Platform Ideal for High Accuracy C2W Bonding, Die Attach, Flip-Chip and 3D Integration with TSV.


SET introduces Innovative Patented Chamber for Removal of Oxide

10/2010 - SET's Latest Developments in Oxide Removal


SET receives strategic wafer level packaging equipment order from SEMATECH at UAlbany NanoCollege

09/2010 - SEMATECH Will Perform Innovative 3D Applications at CNSE’s Albany NanoTech with SET’s High Accuracy FC300 System.


SET to collaborate with IMEC on 3D integration research

01/2009 - A Joint Development Program Will Employ S.E.T.'s High Accuracy FC300 System to Explore Advanced 3D Applications.


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