SET is pleased to introduce the new FC150 ! More information is coming soon.
SET was chosen by BPI France to be certified BPI Excellence this year
At IMAPS Device Packaging 2013 in Scottsdale-USA, CEA-LETI presented the latest development about ultra-fine pitch flip chip.
04/2012 - Key Topics: direct metallic bonding for 3D IC, die to die and die to wafer bonding techniques, technical papers about MEMS packaging or image sensors hybridization...