Micro-tube insertion into aluminum pads

At IMAPS Device Packaging 2013 in Scottsdale-USA, CEA-LETI presented the latest development about ultra-fine pitch flip chip.

SET Insights N°11 is available!

04/2012 - Key Topics: direct metallic bonding for 3D IC, die to die and die to wafer bonding techniques, technical papers about MEMS packaging or image sensors hybridization...