Micro-tube insertion into aluminum pads

At IMAPS Device Packaging 2013 in Scottsdale-USA, CEA-LETI presented the latest development about ultra-fine pitch flip chip.

AWARD: 7ème prix de l'esprit d'entreprendre

On June 6th, 2013 was held, in the building of the Chamber of Commerce and Industry of Lyon (France), the seventh publishing of the “Prix de l'Esprit d'Entreprendre” (the Enterprising Mind Award), organized by the Actors of the Economy and the CJD (young leaders center).

FC300R Die / Flip Chip Bonder with Robotics

07/2011 - Discover SET's FC300R, the easy-to-use platform ideal for high accuracy C2W bonding, die attach, flip-chip and 3D integration.

SET in Chip Scale Review Magazine

11/2011 - To learn more about SET's latest development in Direct Metallic bonding, read the in-depth article published in the last issue of CSR magazine!

Watch the new FC300R Video!

09/2011 - Enjoy the FC300R video and learn about the FC300R production capabilities for Chip-to-Substrate or Chip-to-Wafer assembly as well as Chip-to-Chip stacking.

FC300 with Direct Metallic Bonding configuration

02/2011 - CEA-Leti partnering with SET, STMicroelectronics, ALES and CNRS-CEMES on advanced Chip-to-Wafer technologies for 3D Integration.

On-Line Technology Library

At SET, we attach great importance to the quality of information we provide to our customers. Therefore on a regular basis new technical documents are posted.