SET Smart Equipment Technology SAS 74490 Saint Jeoire - France Tel. : +33 (0)450 35 83 92 Fax : +33 (0)450 35 88 01
KADETT - High Accuracy Placement and Bonding Platform
KADETT K1: The High Accuracy Placement & Semi-Automatic Device Bonder
The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments.
The KADETT's design incorporates flexible system architecture. In its basic version, it performs accurate pick & place functions. The KADETT is easily customized with specific modules such as a UV glue curing system, thermosonic bonding and other innovative options.
Features and Benefits
Sub-micron alignment and repeatability of the XY stage positioning guarantee accurate placement; Simple and robust design, associated to a user friendly and intuitive operator interface allow for quick set-up of new application; The flexible and open design allows tailoring of the configuration to meet the requirements of new applications which is ideal for R&D.
Features and Benefits
Sub-micron alignment and repeatability of the XY stage positioning guarantee accurate placement;
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