FC150: The Most Flexible High Accuracy Die Bonder With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production. Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.
Available as a fully automated system to level, align and bond components ranging in size from 0.2 to 100 mm, the FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesives and Fusion bonding. The FC150 accommodates a wide variety of processes and materials, including extremely fragile materials such as GaAs and HgCdTe. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Bond process changes are easily achieved.

 Features and Benefits

 ± 1 µm 3 sigma post-bond accuracy and 20 µradian leveling guarantee high yields on the most advanced products
 Air bearing construction on a granite structure ensures long-term stability and reliability
 Compression, Z-control and temperature profiling, together with process monitoring, maximize process control
 Optical automatic leveling and alignment enables hands-off operation for production applications
 Nanoimprint Lithography option with Hot Embossing or UV-NIL process without compromising the bonding capability

 High End Processes

Die Bonding, Flip Chip Bonding, Reflow, Fluxless Eutectic Bonding, Thermocompression Bonding, Ultrasonic Bonding, UV-Curing Bonding, Adhesive Bonding, Nanoimprint Lithography (Aligned UV-NIL and Hot Embossing on Wafer)

 Any questions? info@set-sas.fr 
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FC150 Technical Specifications
 SET's Demo Capabilities
Device Bonding Applications
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