TRIAD 05 AP is a high accuracy automatic flip chip bonding system optimized for cost-effective volume production of optoelectronics modules with a sub-micron post-bonding accuracy. It achieves a throughput of up to 200 units per hour with passive alignment mode.   The TRIAD 05 AP accepts piece parts with sizes in the range between 0.1 and 22 mm and with a thickness up to 25 mm. Substrate or package can be as large as 50 mm with thickness up to 22.5 mm. An optional infrared inspection station offers the ability to measure the actual post-bonding accuracy with automatic feedback to the bonding head to tune and maintain the placement precision.

 Features and Benefits

 ± 0.5 µm (3 sigma) post-bond accuracy and 20 microradians leveling in passive alignment mode guarantee high yield
 Optional post-bonding infrared inspection monitors the post bonding accuracy
 Automated component loading systems for complete hands-off and non-stop operation
 Gentle material handling for manipulation of delicate and fragile devices
 A Cost-Effective Volume Production Bonding Cell for the Assembly of Small and Delicate Devices

 High End Processes

Die bonding, flip chip bonding, mass reflow, in-situ reflow, thermocompression bonding, thermosonic, ultrasonic bonding and adhesive bonding.

 Any questions? info@set-sas.fr 
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 Triad 05 AP Technical Specifications