FC300: The High Force and High Accuracy Die Bonder for Large Devices The FC300 High Force Die / Flip Chip Bonder is a newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafer up to 300 mm. The tool features automated handling of chips and substrates up to 100 mm from waffle packs, plus a robotic option enabling chip picking from diced wafer and automated  handling of larger substrate.   It features also Nanoimprinting Lithography (NIL) capabilities.
With a quick process head reconfiguration, the FC300 platform performs multiple applications including:  High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging, or Nanoimprinting using a Hot Embossing Lithography process;  Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly;  UV-Curing for a Adhesive Bonding or for Nanoimprinting using a UV-NIL process.  Any questions? info@set-sas.fr   Download the FC300 brochure:  Request a quotation:

 Features and Benefits

 ± 0.5 µm post bond accuracy and 20 µradians leveling guarantee highest quality for the most advanced products
 Bonding of devices up to 100 x 100 mm onto wafer up to 300 mm to enable large format assemblies
 NIL configuration as add-on to bonding capability for maximum flexibility
 Optional Gas Confinement Chamber with inert or reducing gas for in-situ removal of oxides during bonding
 Air bearing construction on a granite structure ensures long-term stability and reliability
 Optional integrated chamber for gang reflow in a gas or vacuum environment

 High End Processes

Die Bonding (Face Up), Flip Chip Bonding (Face to Face), Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding, Thermocompression Bonding, Ultrasonic Bonding, UV-Curing Bonding, Adhesive Bonding, UV-NIL, Hot Embossing Lithography...

 FC300 Technical Specifications
 SET's demo capabilities
Device Bonding Applications
Nanoimprint Lithography
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