LDP150: The Large Device Bonding Press
The LDP150 Large Device Press is especially designed for large radiation detectors using compression bonding. The device is pressed at room temperature, preserving the initial high accuracy alignment and parallelism. High End ProcessesRoom temperature compression, thermocompression (optional).
Features and Benefits Self leveling system Force up to 100 kN Room temperature compression (heating chuck option) XY accuracy and parallelism maintained within 3 µm
Any questions? info@set-sas.fr Download the LDP150 brochure: Request a quotation:
High End Processes
Self leveling system
Any questions? 
