SET Smart Equipment Technology SAS 74490 Saint Jeoire - France Tel. : +33 (0)450 35 83 92 Fax : +33 (0)450 35 88 01
KADETT Technical Specifications
PERFORMANCES
Placement Accuracy Force Range
+/- 3 µm 35 - 75 N
COMPONENT SIZE
Chip Size Substrate
20 x 20 mm (max) 100 x 200 mm (at room temperature)
BONDING ARM
Z Travel Resolution Theta Travel Resolution
20 mm 0.1 µm +/- 100° 1/1000°
ALIGNMENT STAGE
Travel XY Resolution
296 x 198 mm 0.1 µm
OPTICS
2 Cameras (chip / substrate) Field Of View Depth of Focus
Lens 20X, N.A. 0.4 200 x 198 µm 4.5 µm
OPTIONS
Heated Bonding Head Heated Substrate Chuck UV glue curing system Ultrasonic Bonding Head
22 x 22 mm, 450°C max 50 x 50 mm, 450°C
FACILITY REQUIREMENTS
Footprint (L x D x H) Weight Voltage Frequency Power
1200 x 1000 x 1400 mm Approx 100 kg 240 VAC, 1 Phase + N+ G 50 Hz 2 KVA (Base) Varies with configuration
Data, design and specifications of custom built machines depend on individual process conditions and can vary accordingly to configurations. Not all specifications or options may be valid simultaneously. SET reserves the right to change machine specifications without prior notice.
