PERFORMANCES
COMPONENTS SIZES
Chip Size (Upper Component) Substrate Size (Lower Component)	0.2 - 100 mm 0.5 - 150 mm (option 200 mm)
BONDING ARM: Universal Bonding Arm
Placement Accuracy Post-bonding Accuracy Leveling Travel Z Travel Force	± 1 µm @ 3 sigma ± 1 - 3 µm* ± 0.57 degrees, Resolution 2 µrad 178 mm, Resolution 0.5 µrad 0.3 - 500 N (1000 N and 2000 N optional)
BONDING ARM: SET Reflow Arm
Post-bonding Accuracy Leveling Travel Z Travel Force	± 1 µm @ 3 sigma* ± 0.5 degrees, Resolution 0.05 µrad 162 mm, Resolution 0.5 µrad 0.2 - 4 N
OPTICS
XY Inspection Travel Autocollimator Sensitivity Field of View Pattern Recognition System	100 x 95 mm, Resolution 1 µm 20 µrad on mirror (component roughness & reflectivity dependent) 300 x 240 µm Cognex ™, Resolution 0.42 μm per pixel
ALIGNMENT STAGE
XY Stage Travel Theta Travel Z Travel	300 x 250 mm, Resolution 0.1 µm  ± 7 degrees 11 mm, Resolution 0.25 µm
OPTIONS
Advanced Laser-Leveling System Automatic Alignment for Hands-off Operation Process Recording Chip Solder Flux or Epoxy Coating Unit Gas Confining Enclosure for Mass Reflow	Chip Flipper (configuration dependent) Dispensers:Time/Pressure, Rotary Positive Displacement Pump, Jet Formic Acid Vapor Bonding Environment Nanoimprint Lithography Configuration
GENERAL CHARACTERISTICS
Footprint Height Weight Power Supply	1500 x 980 mm 2170 mm 800 kg 50 - 60 Hz, 1 phase, 200 V/220 V, 2 KVA * Varies with configuration

Data, design and specifications of custom built machines depend on individual process conditions and can vary accordingly to configurations. Not all specifications or options may be valid simultaneously. SET reserves the right to change machine specifications without prior notice.

Any questions? info@set-sas.fr 

 Back to FC150 Description
 SET's Demo Capabilities
Device Bonding Applications
Back to Products