SET Smart Equipment Technology SAS 74490 Saint Jeoire - France Tel. : +33 (0)450 35 83 92 Fax : +33 (0)450 35 88 01
TRIAD 05 AP Technical Specifications
PERFORMANCES
Post Bond Accuracy Force Range
± 0.5 µm (3 sigma with passive alignment method) 0.3 - 5 N
COMPONENT SIZE
Chip Size Substrate
0.2 - 10 mm Up to 50 mm x 50 mm
BONDING ARM
Z Axis Theta Axis Leveling system Heating chuck Heating Speed
Travel 190 mm, resolution 30 nm Travel ± 45 degrees, resolution 3 µradians Travel ± 1.1 degrees, resolution 2 µradians 22 x 22 mm, RT to 450°C 75°C/s
ALIGNMENT STAGE (SUBSTRATE)
XY axis Z axis Theta axis
Travel 170 x 60 mm, resolution 10 nm 25 mm, resolution 50 nm ± 45 degrees, resolution 3 µradians
OPTICS
XY Stage Field of View Illumination Autocollimator Sensitivity
Travel 210 x 60 mm, resolution 10 nm 870 x 690 µm (20 X Lens) Brightfield / Darkfield by LED 20 µradians
OPTIONS
Advanced Laser-Leveling System Face Up Station
UV glue curing system, Fluid dispenser Ultrasonic Bonding Head
FEEDING MODULE
Production Version
R&D version
Includes a fully automatic system wit a feeding robot Component storage option includes Waffle pack and Tape on Reel Robot is removed, but can be installed later on
FACILITY REQUIREMENTS
Footprint (L x D x H) Weight Power
2160 x 1700 x 2100 mm Approx 2100 kg 240/400 V, 8 kVA, 47-63 Hz Varies with configuration
Data, design and specifications of custom built machines depend on individual process conditions and can vary accordingly to configurations. Not all specifications or options may be valid simultaneously. SET reserves the right to change machine specifications without prior notice.
