0.2 to 100 mm Up to 200 mm x 200 mm or on Wafer up to 300 mm Ø
BONDING ARM: Universal Bonding Arm
Post-Bonding Accuracy Z Travel Leveling Travel Bonding Heads Heating Force
± 0.5 µm @ 3 sigma* 180 mm, Resolution 0.03 µm ± 1 degree, Resolution 4.2 µrad Sq. 22, 50 or 100 mm RT to 450°C, Resolution 1°C 5 to 4,000 N*
ALIGNMENT STAGE
XY Stage Travel Theta Travel
410 x 395 mm, Resolution 0.01 µm ± 5 degrees, Resolution 0.4 µradian
OPTICS
XY Inspection Travel Autocollimator Sensitivity Digital Camera Resolution Field of View Pattern Recognition System
100 x 80 mm, Resolution 0.01 µm 20 µradian on mirror 0.55 µm per pixel Illumination Bright Field & Dark Field by LED 890 x 680 µm CognexTM
OPTIONS
Fluid Dispenser Advanced Laser-Leveling System Face Up Station Collective Reflow Chamber with Vacuum or Formic Acid Capabilities
Nanoimprint Lithography Capabilities by Hot Embossing or UV-NIL: Imprinting Resolution Sub-50 nm Overlay Accuracy 250 nm
FACILITY REQUIREMENTS
Footprint Height Weight Power Supply
1960 x 2100 mm 2163 mm 3000 kg 200V/400V, 3 Phases, 12.5 kVA, 50/60 Hz *Varies with configuration
Data, design and specifications of custom built machines depend on individual process conditions and can vary accordingly to configurations. Not all specifications or options may be valid simultaneously. SET reserves the right to change machine specifications without prior notice.
