Up to 300 mm diameter 50 x 50 mm or 65 x 65 mm (100 mm optional)
IMPRINTING ARM
Imprinting Force Z axis Pre-leveling axis Self leveling stage sensitivity
5 N up to 4 kN (varies with Imprinting Head installed) Travel 160 mm, resolution 50 nm, programable speed Travel ± 1 degree, resolution 4.7 µradians Flexure stage, final leveling occurs at imprinting stage Varies with Imprinting head (0.76 to 7.6 mNm/µradian)
IMPRINTING HEADS
UV-NIL Head
Hot Embossing Head
Stamp size: 50 mm or 65 mm Exposure area: 40 x 40 mm (UV LED 365, 375 or 395nm available) Stamp size: 50 mm or 65 mm Heating up to 450°C
SUBSTRATE CHUCK
Room Temperature Chucks Heating Chucks Temperature Range Sizes available
For machine configured for UV-NIL only For machine configured for HEL (also compatible with UV-NIL) RT to 450° Square 50, 100, 150, 200 mm
ALIGNMENT OPTICS
XY Stage Field Of View Illumination Autocollimator for pre-leveling
Travel compatible with stamp size up to 100mm, resolution 10 nm 870 x 690 µm (Lens 20X) Brightfield / Darkfield by LED (Wavelength 660 nm) Sensitivity < 20 µradians
ALIGNMENT STAGE (SUBSTRATE)
XY axes Theta Axis
Travel 395 x 395 mm, Resolution 10 nm Travel ± 5 degrees, resolution 0.4 µradian
OPTIONS
Advanced Laser-Leveling System Fluid dispenser for cold embossing
Automatic alignment for hands-off operation Wafer feeding module
FACILITY REQUIREMENTS
Footprint (L x D x H) Weight Power
1600 x 1450 x 2180 Approx 3000 kg 230/400 V, 10 kVA, 47-63 Hz Varies with configuration
Data, design and specifications of custom built machines depend on individual process conditions and can vary accordingly to configurations. Not all specifications or options may be valid simultaneously. SET reserves the right to change machine specifications without prior notice.
