One of the main challenges in the assembly of optoelectronic devices lies in the post bonding/alignment accuracy. When it comes to the realm of high accuracy bonding - down to 0.5 µm for advanced applications - SET's leadership role is unmatched in the industry. Nowhere is this more evident than in the development of advanced optoelectronic & photonic packaging. In the field of high-speed and telecommunications fiber optic networks, the quality of the transmission signal is a critical factor in product performance. When aligning the laser to the optic fiber core, any differentiation greater than 1 µm results in unacceptable signal loss.
The advanced capabilities of V-groove positioning for the optical fiber has shifted the burden for accuracy from the fiber to the laser chip: these components must be correctly aligned for optimum performance. SET Device Bonders which can combine passive and active alignment together with fast heating and cooling cycles offer the ideal solution. SET Bonders will handle even the most fragile materials delicately (i.e. lenses, prism, mirror, wave guide, active components) throughout the bonding process.
The result: purer signal transmission, higher frequency operation, increased signal capacity and information clarity - crucial factors in an age when voice, picture and data all travel long distances on a single mode fiber. The various components in an optoelectronic device often require standard die attach as well as flip chip bonder. The solution provided by the SET Flip Chip Bonders is the capability to perform both processes within the same cycle. Any questions? info@set-sas.fr		Courtesy Axsun Technologies

 Technology News

SET has developed a substrate chuck and a bond head with a localized confinement chamber which operates safely with reducing gases such as forming gas or formic acid vapor. This patented configuration has been successfully implemented on SET bonder models FC150 and FC300. Especially suited for bonding applications such as IR-FPA, 3D-IC and optoelectronics..., this machine function enables to remove or prevent oxide formation.
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