CSP3D for auditive prothesis with three dies assembled by Glued Flip Chip with stud bumps & non conductive adhesive - Substrate Full Flex / 4 layers - Thickness = 100um
The versatility of SET's Device Bonders has proven to be a valuable asset in creating high accuracy alignment levels for multichip modules, compound devices and LCD displays. Standard MCM applications such as automotive electronics and computers, and LCD/COG (chip-on-glass) applications for watches, telephones and other read-out displays have been largely perfected with current flip chip technology.		Courtesy of Valtronic Technologies
SET's Bonders share many features that make the most of flip chip technology. Features such as a flexible user interface, auto alignment capability, and automatic tool exchange enable high-end flip chip bonding applications with maximum ease. SET's Flip Chip Bonders have process mixing capabilities that allow multiple bonding processes within a single cycle. This provides unsurpassed flip chip bonding flexibility in a multichip environment.		Multichip module with three dies assembled by Glued Flip Chip with stud bumps & non conductive adhesive - Substrate Full Flex /  4 layers - Thickness = 100um - Minimum distance beetween two dies = 200um
As further testament to their versatility, SET's bonders can easily be adapted for handling different sized chips in the same cycle. Any questions? info@set-sas.fr		Chip on Glass - Courtesy: CEA LETI Photo: Artechnique