History

SET develops and manufactures advanced assembly equipments and Nanoimprint Lithography solutions for the semiconductor market. Since 1975, we have pioneered in the development of flip chip bonders for Infrared sensors & optoelectronics applications.

1975 Establishment of Sulzer Electro-Technique (S.E.T.) by M. Jean Schmidt
1993 S.E.T joined Karl SUSS Group
Adding Spin Coaters and Device Bonders to the SUSS Portfolio
2001 Karl SUSS France is renamed SUSS MicroTec SAS and fulfill two missions:
        - Sales and service for all SUSS Product in France
        - Device Bonder Division site (worlwide responsibility)
2007 Management Buy Out of SUSS MicroTec Device Bonder division
by Gael Schmidt (president of the SUSS MicroTec Device Bonder Division)
The new company is named:

2008 SET joined Replisaurus Technologies
SET is the ECPR equipment source for Replisaurus Technologies
Synergy in 3C-Integration TSV: Redistribution, Via Filling, C2W Assembly

 A Few Technical Milestones:

1976 Optical sorting machine
1977 Semi-automated analytical probe station
1978 Mask Aligner using X-Ray source
1978 Large photo-resist spin coater (flat panel displays)
1981 First Commercially available Flip Chip Bonder
1983 Wafer laser marker (patented robotic system)
1985 Automated probe station
1988 GYRSET system – Innovative spin coating concept
A Huge Step to unrivalled thickness uniformity and cost saving
1991 Innovative Dispensing Pump Virgin & Vulcan
1993 Large area mask aligner (12 & 16 inches)
2005 Nano Imprinting Stepper NPS300
Cooperation with VTT Microelectronics - NaPa European Project
2007 Introduction of three innovative Bonders KADETT, FC300 and LDP150

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