SET Smart Equipment Technology SAS 74490 Saint Jeoire - France Tel. : +33 (0)450 35 83 92 Fax : +33 (0)450 35 88 01
The SET Technical Bulletin N°3 is now available!
The free SET Technical Bulletin is a compilation of flip chip and die bonding technical articles written by our clients.
With the trend to apply the advantages of these technologies more widely than ever before – these timely articles will be a welcome addition to your personal reference collection.
Neatly organized and presented, each article provides unique insights into the exciting area of die-to-die and die-to-wafer bonding techniques and processes.
A few titles:
Study of 15μm Pitch Solder Microbumps for 3D-IC Integration;
A Fluxless Bonding Process using AuSn or Indium for a Miniaturized Hermetic Package;
High Density Cu-Sn TLP Bonding for 3D Integration;
Three Dimensional Interconnects with High Aspect Ratio TSVs and Fine Pitch Solder Microbumps;
An innovative die to wafer 3D integration scheme : Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling;
3D Stacked Chip Technology Using Bottom-up Electroplated TSVs;
Should you want to receive a free printed copy, please fill-in the form below. Specify in the "Comments" section that you want want a printed copy. We will send it to you as soon as possible.
Study of 15μm Pitch Solder Microbumps for 3D-IC Integration; 
