Product Focus

The High Accuracy Placement & Semi-Automatic Bonder The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments. The KADETT's design incorporates flexible system architecture. In its basic version, it performs accurate pick & place functions. The KADETT is easily customized with specific modules such as a UV glue curing system, thermosonic bonding and other innovative options.

 Features and Benefits

Sub-micron alignment and repeatability of the XY stage positioning guarantee accurate placement;  Simple and robust design, associated to a user friendly and intuitive operator interface allow for quick set-up of new application;  The flexible and open design allows tailoring of the configuration to meet the requirements of new applications which is ideal for R&D.  High End Processes: Die bonding, flip chip bonding, in-situ reflow, thermocompression bonding, thermosonic bonding, UV-curing bonding.

 Download the brochure of the KADETT in pdf 

 Presentation from the University of Cambridge*

* These Powerpoint slides were originally presented at the Asia Communications and Photonics Conference and Exhibition held in Shanghai, China, November 2-6, 2009. They are posted here with the permission of the Optical Society (OSA) and SPIE.

 Download the entire presentation

 Any questions? info@set-sas.fr 

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