Global Commitment to our Customers
The world of submicron device bonding applications requires special attention in the design, assembly and set-up of the flip-chip bonder but also in the tuning of the process parameters. SET team puts continuous effort to keep improving:
- Product Performance,
- Reliability / Repeatability,
- Customized Solutions,
- Process Support,
- After-Sales Service.
We know the importance of providing efficient technical support to our customers before, during and after installation of our systems. In order to ensure that our customers receive benefit of both excellent service and access to ongoing technological advances, we maintain teams of experts in locations around the world. By working closely with our customers, these experts also provide a continuous stream of communication from the field to our factory. This ongoing communication is one of the many reasons why our solutions have such a high degree of flexibility and precision engineered, application-specific features.
Conveniently located nearby highways at only 40 minutes from Geneva Int’l Airport and 90 minutes from Grenoble, one of the main French (and worldwide) Microelectronics Centers, SET's facility consists of 725 m² (7,500 ft²) of clean rooms and adjacent offices and meeting rooms, equipped with latest generation equipment at Saint-Jeoire, France.
In addition to the use of the demo machine, you will have the possibility of discussing with our experienced application engineers who are available to accompany and guide you all the way through the evaluation process.
Beside this demo facility at SET’s Head Quarter, tests can also be made at some worldwide customers' sites, depending on cooperating agreements signed.
In USA, a demo lab is established at FLIR's facility in Ventura, CA, including a ONTOS surface preparation system and a FC150 equipped with a double arm configuration.
It's a unique opportunity to evaluate our bonders ability to meet your highest expectations: don't miss it! For further details on SET's demo capabilities, or to discuss your evaluation needs, please contact:
For Asia, Europe and ROW
SET Corporation SA
Jean Stephane Mottet, Applications Mgr
Tel: +33 450 35 38 01
For USA and Canada
Matt Phillips, Director of Technical Sales
Cell: +1 603 548 7870
Our highly competent support teams provide in-depth trainings, which enable our customers to derive maximum benefit from our Flip-Chip Bonders. Training is conducted either at SET facilities or at our customers’ own production facilities. We propose two types of trainings: User and Maintenance. We also provide Application Support to enable you to get the best performances out of our bonders.
For more information about the schedule or the content of each training, please call SET: +33 (0)450 35 83 92 or fill in the inquiry form.
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