Pascal Metzger, CEO annonces
After almost 36 years working at SET, Gilbert Lecarpentier has decided to retire. We have all enjoyed his availability and appreciated his technical advises. All his colleagues wish him good luck for his new life and hope he will take some rest after these intense years. All SET Corporation team remains present to answer to any questions you may have concerning your applications, your machines or any further needs.
Conferences and Exhibitions
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May 7-9, 2013 |
Marina Bay Stands Expo, Singpaore SET will be at APP' booth #704 |
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May 28-31, 2013 |
Cosmopolitan of Las Vegas, Las Vegas, Nevada, USA |
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Date
On-Line Technology Library
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Hot Products
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Easy-to-use platform ideal for high accuracy C2W bonding, die attach, flip-chip and 3D integration. Capable of handling a wide range of components. High level of automation. |
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Based on the FC300 and adapted to direct metallic bonding requirements. First unit installed at CEA-Leti to explore Chip-to-Wafer structures by direct metallic bonding for 3D integration. |
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Patented confinement chamber usable for oxide reduction in Chip-to-Chip and Chip-to-Wafer applications. |
Back to Homepage At SET, we attach great importance to the quality of information we provide to our customers. Therefore on a regular basis new technical documents will be posted.