Conferences and Exhibitions

    Dates

    Event

    Location

February 7-9, 2012

Semicon Korea
Woowon Technology's Booth #2618 in Hall A

COEX, Seoul,
Korea

March 6-8, 2012

Device Packaging
Booth #50

Radisson Fort McDowell Resort and Casino,
Scottsdale, AZ, USA

May 29-June 1, 2012

ECTC
Booth #601

Sheraton Hotel and Marina,
San Diego,
CA, USA


 On-Line Technology Library 

At SET, we attach great importance to the quality of information we provide to our customers. Therefore on a regular basis new technical documents will be posted.
 Technical papers  Video  E-newsletter  Conference proceedings  Brochures  Press releases


 Product News

    New Machine Feature

     Description



 FC300R High Force Bonder with Robotics

     
         FC300R video!

Easy-to-use platform ideal for high accuracy C2W bonding, die attach, flip-chip and 3D integration. Capable of handling a wide range of components. High level of automation.
 Learn more

 Any questions? 
egreneche@set-sas.fr 



 FC300 Submicron Die
Bonder for Direct Metallic Bonding

Based on the FC300 and adapted to direct metallic bonding requirements. First unit installed at CEA-Leti to explore Chip-to-Wafer structures by direct metallic bonding for 3D integration.
 Learn more



 Any questions? 
egreneche@set-sas.fr


 Semi-Open Confinement
   Chamber

Patented confinement chamber usable for oxide reduction in Chip-to-Chip and Chip-to-Wafer applications.
 Learn more


 Any questions? 
egreneche@set-sas.fr




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