Conferences and Exhibitions

    Dates

    Event

    Location

September 8-10, 2010

Semicon Taiwan
Booth N°1320

Tapei World Trade Center,
Taiwan

September 13-16, 2010

ESTC
Booth N°21

Maritim proArte Hotel in Berlin, Germany

October 11-14, 2010

IWLPC

Santa Clara Marriott Hotel, USA


 Product News

    New Machine Feature

     Description


 Semi-Open Confinement
   Chamber

Patented confinement chamber usable for oxide reduction in Chip-to-Chip and Chip-to-Wafer applications.
 Learn more


 Any questions? 
egreneche@set-sas.fr




 Technical Papers

Focus on Flip Chip & Die Bonding...

Focus on Nanoimprint Lithography...

with the SET
Technical Bulletin N°3!

with the NaPa
Library of Processes!

 The SET Technical Bulletin N°3 is a compilation of technical articles featuring applications performed by our clients with SET's bonders.

 The NaPa Library of Processes is a 152 pages book giving all directions needed to chose and apply an alternative nano-patterning technique.

 click here to download your free copy!

 click here to download your free copy!


 On-Line Technology Library

At SET, we attach great importance to the quality of information we provide to our customers. Therefore on a regular basis new technical documents (conference proceedings, technical papers, e-newsletters, application notes, press releases, etc...) will be posted.
 
Technology Library
 


 
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