Since the introduction of mass reflow in the 60's, flip chip technology has made steady advances in the chip attach process - driven by ever-increasing demands for faster, smaller and less expensive components. In the early 1980's, SET delivered the first commercially available flip chip bonder through a collaboration with CEA/Leti. The introduction of its superimposing microscope, established SET as the industry leader for high accuracy placement.
SET continues to pioneer the die bonding and flip chip technology at the process development level with the high flexibility of its Device Bonding line, delivering the same accuracy levels and component handling capabilities from R&D needs to the production floor.
FC300R High Force Die Bonder / Flip Chip Bonder with Robotics The FC300R is an automated bonder that addresses the needs of the pre-production environment. It offers production capabilities for Chip-to-Substrate or Chip-to-Wafer assembly as well as Chip-to-Chip stacking. FC300RDemo Capabilities Request a quotation:
FC300 High Precision Die Bonder / Flip Chip Bonder The SET's FC300 High Precision Device Bonder is a new generation of high accuracy and high force system for populating wafer up to 300 mm. The system is available with Nanoimprinting capabilities. FC300Demo Capabilities Request a quotation:
FC150 Automated Die Bonder / Flip Chip Bonder With ± 0.5 µm placement and ± 1µm post-bond accuracy, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. FC150Demo Capabilities Request a quotation:
LDP150 Large Device Press The LDP150 Large Device Press is especially designed for large radiation detectors using compression bonding. Applications: Infrared Focal Plane Arrays (IR-FPA), Large XY, UV detectors. LDP150Demo CapabilitiesRequest a quotation:
TRIAD 05 AP High Accuracy Assembly Cell With a post-bonding accuracy of ± 0.5 µm using passive alignment method and active alignment capability, the TRIAD 05 AP is especially designed for optoelectronic applications. TRIAD 05 APDemo CapabilitiesRequest a quotation:
KADETT High Accuracy Placement and Bonding Platform The SET KADETT Pick and Place is a high accuracy placement and bonding system enabling the assembly of devices on a wide variety of substrates. KADETTDemo CapabilitiesRequest a quotation:
NPS300 Nano imPrinting Stepper The NPS300 is the first ever tool able to combine aligned Hot Embossing and UV-NIL on the same platform with no compromise on imprinting results. NPS300Demo CapabilitiesRequest a quotation:
SET continues to pioneer the die bonding and flip chip technology at the process development level with the high flexibility of its 
DEVICE BONDING LINE
