Since the introduction of mass reflow in the 60's, flip chip technology has made steady advances in the chip attach process - driven by ever-increasing demands for faster, smaller and less expensive components. In the early 1980's, SET delivered the first commercially available flip chip bonder through a collaboration with CEA/Leti. The introduction of its superimposing microscope, established SET as the industry leader for high accuracy placement.

 SET continues to pioneer the die bonding and flip chip technology at the process development level with the high flexibility of its Device Bonding line, delivering the same accuracy levels and component handling capabilities from R&D needs to the production floor. 

 SET develops and manufactures also Nanoimprint Lithography tools to address requirements for NIL research or production needs.

DEVICE BONDING LINE
FC300 High Force Die Bonder / Flip Chip Bonder The SET's FC300 High Force Device Bonder is a new generation of high accuracy and high force system for populating wafer up to 300 mm. The system is available with Nanoimprinting capabilities. Bonding processes: Die Bonding, Flip Chip Bonding, Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding, Thermocompression Bonding, Ultrasonic Bonding, UV-Curing Bonding, Adhesive Bonding, UV-NIL, Hot Embossing Lithography... FC300
FC150 Automated Die Bonder / Flip Chip Bonder With ± 0.5 µm placement and ± 1µm post-bond accuracy, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. Bonding processes: Die Bonding, Flip Chip Bonding, Reflow, Fluxless Eutectic Bonding, Thermocompression Bonding, Ultrasonic Bonding, UV-Curing Bonding, Adhesive Bonding... FC150
FC250 Production Die Bonder / Flip Chip Bonder The SET's FC250 High Accuracy Production Device Bonder offers the most precise (placement at ± 0.5 µm) packaging capability. Bonding processes: Die Bonding, Flip Chip Bonding, Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding, Thermocompression Bonding, Ultrasonic Bonding, UV-Curing Bonding, Adhesive Bonding... FC250
TRIAD 05 AP High Accuracy Assembly Cell With a post-bonding accuracy of ± 0.5 µm using passive alignment method and active alignment capability, the TRIAD 05 AP is especially designed for optoelectronic applications. Bonding processes: Die Bonding, Flip Chip Bonding, Mass Reflow, In-Situ Reflow, Thermocompression Bonding, Thermosonic and Ultrasonic Bonding and Adhesive Bonding... TRIAD 05 AP
KADETT High Accuracy Placement and Bonding Platform The SET KADETT Pick and Place is a high accuracy placement and bonding system enabling the assembly of devices on a wide variety of substrates. Bonging processes: Die Bonding, Flip Chip Bonding, In-Situ Reflow, Thermocompression Bonding, Thermosonic Bonding, UV-Curing Bonding... KADETT
LDP150 Large Device Press The LDP150 Large Device Press is especially designed for large radiation detectors using compression bonding. Bonding Processes: Room Temperature Compression, Thermocompression (Optional). Applications: Infrared Focal Plane Arrays (IR-FPA), Large XY, UV detectors. LDP150
Request a quotation:  Any questions? info@set-sas.fr
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NANOIMPRINT LITHOGRAPHY EQUIPMENT NPS300 Nano imPrinting Stepper The NPS300 is the first ever tool able to combine aligned Hot Embossing and UV-NIL on the same platform with no compromise on imprinting results.  NPS300
Request a quotation:  Any questions? info@set-sas.fr

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