SET Device Bonders offer precise and flexible packaging and assembly capabilities. They support a wide range of applications: 3D integration, optical packaging using high speed passive alignment (e.g. laser diodes), IR-FPA, SiP, LCD drivers, MEMS, and more. For optoelectronics applications, the high accuracy provided by our device bonders result in less signal loss and higher product yield at low cost.
Low cost production solutions of nanostructures are in development, that may be the driving forces of Semiconductor, MOEMS and optoelectronics technology tomorrow. In particular, Nanoimprint lithography (NIL) and its variations have been developed as a cost-effective alternative to high-resolution e-beam lithography to print sub-20 nm geometries. NIL Technology
Device Bonding Applications 
