In the submicron world of device bonding applications, SET is setting standards for equipment design, ease-of-use flexibility. SET's Device Bonders lead the industry in:
Product Performance, Reliability / Repeatability of Results, Customized Solutions, Process Support, After-Sales Service / Uptime.
We understand the critical importance of providing efficient technical support to our customers before, during and after installation of our manufacturing systems. In order to ensure that our customers receive benefit of both excellent service and access to ongoing technological advances, we maintain teams of experts in locations around the world. By working closely with our customers, these experts also provide a continuous stream of communication from the field to our factory. This ongoing communication is one of the many reasons our solutions have such a high degree of flexibility and precision engineered, application-specific features.
Demo Capabilities
In order to satisfy interest from potential customers raised by the exciting area of die-to-die and die-to-wafer bonding, SET offers you the possibility to organize demo at our facilities in Saint-Jeoire. Conveniently located at 30 minutes from Geneva Int’l Airport and at 90 minutes from Grenoble, one of the main French Microelectronics poles, SET's workshop consists of 725 m² of clean rooms and adjacent offices. In addition to the use of the demo machine, you will have the possibility of discussing with our experienced application engineers who are available to accompany and guide you all the way through the evaluation process.
As SET recently signed cooperating agreements with some clients, demonstrations can also be made at some customers' sites: Sematech in USA, IMEC in Belgium, CEA-Leti in France, etc... Besides this, a SET demo lab will be inaugurated in July at Aerius' facility in Ventura, CA. This demo center includes a FC150 equipped with a double arm configuration to successfully perform chip-to-chip bonding for high density 3D integration, IR-FPA hybridization, optoelectronics and MEMS packaging, etc...
It's a unique opportunity to evaluate all our bonder models' abilities to meet your highest expectations: don't miss it!
For further details on SET's demo capabilities, or to discuss yourevaluation needs, please contact:
Our highly competent support teams provide in-depth trainings, which enable our customers to derive maximum benefit from our Die Bonders. Training is conducted either at SET facilities or at our customers’ own production facilities. We offer two types of trainings: User and Maintenance.
For more information about the schedule or the content of each training, please contact:
Global Commitment to our Customers
Product Performance, 
For USA and Canada
