Technical Papers

Focus on Flip Chip & Die Bonding...	Focus on Nanoimprint Lithography...
with the SET Technical Bulletin N°3!	with the NaPa Library of Processes!
The SET Technical Bulletin N°3 is a compilation of technical articles featuring applications performed by our clients with SET's bonders.	The NaPa Library of Processes is a 152 pages book giving all directions needed to chose and apply an alternative nano-patterning technique.
click here to download your free copy!	click here to download your free copy!

 Conferences and Exhibitions

Dates	Event	Location
March 9-11, 2010	Device Packaging 2010  Booth #32 Don't miss SET's presentation!	Radisson Fort McDowell Resort and Casino, Scottsdale, Arizona, USA
March 16-18, 2010	Semicon China 2010 Booth # 2477 in Hall W2	Shanghai New International Expo Centre (SNIEC), China

 On-Line Technology Library

At SET, we attach great importance to the quality of information we provide to our customers. Therefore on a regular basis new technical documents (conference proceedings, technical papers, e-newsletters, application notes, press releases, etc...) will be posted.
 Technology Library
 

 Hot Products 

Product Name	Description
	High Force Device Bonder with NIL Capabilities	Read More
	Large Device Press for Compression of Large Detectors	Read More
	Nano imPrinting Stepper with Hot Embossing and UV-NIL Capabilities	Read More

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