Technical Papers

Focus on Flip Chip & Die Bonding...

Focus on Nanoimprint Lithography...

with the SET
Technical Bulletin N°3!

with the NaPa
Library of Processes!

 The SET Technical Bulletin N°3 is a compilation of technical articles featuring applications performed by our clients with SET's bonders.

 The NaPa Library of Processes is a 152 pages book giving all directions needed to chose and apply an alternative nano-patterning technique.

 click here to download your free copy!

 click here to download your free copy!


 Conferences and Exhibitions

Dates Event Location

March 9-11, 2010

Device Packaging 2010 
Booth #32
Don't miss SET's presentation!

Radisson Fort McDowell Resort and Casino, Scottsdale, Arizona, USA

March 16-18, 2010

Semicon China 2010
Booth # 2477 in Hall W2

Shanghai New International Expo Centre (SNIEC), China


 On-Line Technology Library

At SET, we attach great importance to the quality of information we provide to our customers. Therefore on a regular basis new technical documents (conference proceedings, technical papers, e-newsletters, application notes, press releases, etc...) will be posted.
 Technology Library
 

 Hot Products 

Product Name

Description

High Force Device Bonder with NIL Capabilities


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Large Device Press for Compression of Large Detectors


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Nano imPrinting Stepper with Hot Embossing and UV-NIL Capabilities


 
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