SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die Bonders/Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. SET is the former Device Bonder Division of SUSS MicroTec.
As a supplier of semiconductor equipment dedicated to high precision applications for over 30 years, SET has developed over 30 different types of equipment.
With more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its bonders. First introduced in 1981, the Device Bonder line became the primary focus of the company in 1997.
Ranging from manual loading version to fully automated operation, our bonders cover all main bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.
