SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonders and versatile Nanoimprint Lithography (NIL) solutions. SET is the former Device Bonder Division of SUSS MicroTec. SET joined Replisaurus Technologies in 2008. SET is the ECPR (ElectroChemical Pattern Replication) equipment source for Replisaurus.
Supplier of semiconductor equipment dedicated to high-end applications for over 30 years and with more than 300 Device Bonders installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its bonders. Ranging from manual loading version to fully automated operation, our bonders cover all main bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.

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Any questions? info@set-sas.fr 

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