FC150

With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production.

Able to level, align and bond components ranging in size from 0.2 to 100 mm, the FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesives and Fusion bonding. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.

Key Benefits

  ± 1 µm 3 sigma post-bond accuracy and 20 µradian leveling guarantee high yields on the most advanced products

  Semi-Open Confinement Chamber for Oxide Reduction (option)

  Air bearing construction on a granite structure ensures long-term stability and reliability

  Compression, Z-control and temperature profiling, together with process monitoring, maximize process control

  Optical automatic leveling and alignment enables hands-off operation for production applications

  Nanoimprint Lithography option with Hot Embossing or UV-NIL process without compromising the bonding capability

Technical Data

Datasheet FC150

Process Capabilities

The FC150 accommodates a wide variety of materials, including extremely fragile materials such as GaAs and HgCdTe and processes:


  Die Bonding, Flip Chip Bonding

  Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding

  Thermocompression, Ultrasonic and Adhesive Bonding

  Gold, Gold/Tin, Indium, UV or Thermal Cure Adhesive, Polymers...

  Fragile Material Compatibility: InP, GaAs, MCT...


Bond process changes are easily achieved.

Applications

  Chip-to-Chip, Chip-to-Substrate Bonding, Chip Stacking

  3D Integration

  Optoelectronic & Photonic Devices Assembly

  MOEMS, MEMS, MCM

  Nanoimprint Lithography: Aligned UV-NIL and Hot Embossing on Wafer