The LDP150 is an Electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150 mm). It uses compression process at room temperature (thermo-compression option available). A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150.
The LDP150 is able to apply pressure up to 100,000 N. The device is pressed at room temperature, preserving the initial high accuracy alignment and parallelism.
Self leveling sphere moving on air bearing and locked by vacuum preserves the initial parallelism of the component stack
High force (up to 100,000N) and controlled force profile ensure bond join quality
Granite base and rigid stiff steel structure maintain the initial high accuracy of the assembly
Room Temperature Compression
Bonding is achieved by pressing the components together with accurate control of the force profile
Priority can be given either to the force or to the gap variation
Parallelism and gap are monitored at all time during the bonding sequence
The devices are pressed together at room temperature while preserving the initial high accuracy alignment