The ACCµRA 100 is a semi-automatic flip-chip bonder that guarantees +/- 0.5 µm post-bonding accuracy.
Its flexibility makes it ideal for developing a wide range of applications.
The ACCµRA 100 combines high precision, accessibility and cost-effectiveness.
It is the perfect equipment for universities and R&D institutes.
- Small footprint
- Easy to use
- Quick Set-Up
- R&D oriented
- High Force
Click here to request the ACCµRA 100 Datasheet.
- UV Curing
- Au, Au/Sn, In, Cu, Cu/Sn