The ACCμRA M is a manual flip-chip bonder that allows ± 3 μm accuracy. This equipment permits to align manually the components with a high level of precision.
The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.
The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.
It is the perfect equipment for universities and R&D institutes.

Key Benefits

  • Small footprint
  • Manual machine
  • Easy to use
  • Open platform
  • R&D oriented

Technical Data

Click here to request the ACCµRA M Datasheet.



Process Capabilities

  • Thermocompression
  • Reflow
  • UV Curing
  • Au, Au/Sn, In, Cu