Nouveautés & Evènements

EMPC 2019, September 16-19, Conference Center PISA Italy

Attend to this conference and to SET presentation.

Meet our experts, to learn more about high accuracy flip-chip bonding.

SEMICON Taiwan 2019 - Sept 18-20, 2019, Taipei Nangang Exhibition Center Hall 1 - Taiwan

SET and DKSH will be exhibiting at SEMICON Taiwan 2019.

If you would like to arrange a meeting during SEMICON Taiwan 2019, feel free to contact us.


SEMICON Europa 2019, 12-15 November, Messe München, Munich, Germany

SET will be exhibiting at SEMICON Europa 2019, the Largest Microelectronics Event in Europe !

Visit us on booth #B1.112 to discover our different ranges of Flip-Chip Bonders