Nouveautés & Evènements

ECTC | May 26-29, 2020 | Lake Buena Vista, FL, USA

2020 IEEE 70th Electronic Components and Technology Conference

Visit SETNA (SET North America) at ECTC and discuss with our experts on your needs!

Feel free to contact us to arrange a meeting.

 


MiNaPAD | May 27-28, 2020 | WTC, Grenoble, France

Pascal METZGER, CEO of SET, will present a paper entitled "Die-to Wafer Hybrid bonding equipment: throughput versus precision".

Come listen to him at MiNaPAD and meet him to discuss about your needs and our expertise.

 


JPCA Show | May 27-29, 2020 | Tokyo Big Sight, Japan

Meet the SET experts at JPCA Show, at our Marubun partner booth. 

Feel free to contact us to arrange a meeting.

 


SEMIEXPO RUSSIA | June 9-10 | Moscow, Russia

Meet SET experts at SEMIEXPO RUSSIA, at our Dipaul partner booth. 

Feel free to contact us to arrange a meeting.

 


SEMICON China | June 27-29, 2020 | SNIEC, Shanghai, China

SET will be attending SEMICON China at Shanghai New International Expo Centre.

Visit SET at Booth # T1321 and meet our experts.

To make advance arrangements with our team, feel free to contact us.