ECTC | May 26-29, 2020 | Lake Buena Vista, FL, USA
Feel free to contact us to arrange a meeting.
MiNaPAD | May 27-28, 2020 | WTC, Grenoble, France
Pascal METZGER, CEO of SET, will present a paper entitled "Die-to Wafer Hybrid bonding equipment: throughput versus precision".
Come listen to him at MiNaPAD and meet him to discuss about your needs and our expertise.