Nouveautés & Evènements

SEMICON Europa | 12-15 November, 2019 | Messe München, Munich, Germany

SET will be exhibiting at SEMICON Europa 2019, the Largest Microelectronics Event in Europe!

Visit us on booth #B1.112 to discover our different ranges of Flip-Chip Bonders


NEPCON JAPAN | January 15-17, 2020 | Tokyo Big Sight, Japan

Visit SET and MARUBUN at NEPCON JAPAN.

To arrange a meeting during NEPCON JAPAN, feel free to contact us.


SPIE Photonics West | February 1-6, 2020 | San Francisco, California, USA

Meet our Flip-Chip Bonders experts on SET booth.

Feel free to contact us to arrange a meeting.