EMPC 2019, September 16-19, Conference Center PISA Italy
Attend to this conference and to SET presentation.
Meet our experts, to learn more about high accuracy flip-chip bonding.
SEMICON Europa 2019, 12-15 November, Messe München, Munich, Germany
SET will be exhibiting at SEMICON Europa 2019, the Largest Microelectronics Event in Europe !
Visit us on booth #B1.112 to discover our different ranges of Flip-Chip Bonders.